Show-Me State Times

Researchers at the University of Missouri have developed a new method for manufacturing computer chips that could make the process more efficient and environmentally friendly. The team introduced ultraviolet-enabled atomic layer deposition (UV-ALD), which uses UV light to control where thin layers of material are applied during chip fabrication.

Traditionally, atomic layer deposition (ALD) is used to coat ultra-thin layers across the entire surface of a chip, including areas that should remain uncoated. This can cause problems when working with chips containing billions of transistors, as unwanted coatings may affect performance.

The new UV-ALD technique allows engineers to target specific areas by making surfaces “sticky” only where UV light has been applied. According to Matthias Young, an assistant professor involved in the research, “Our process cuts the traditional four or five manufacturing steps down to just two. We make the surface ‘sticky’ using UV light and then apply the coating. It only attaches where the light has been applied.”

This targeted approach reduces both time and materials needed for production. It also offers environmental benefits. Andreas Werbrouck, a postdoctoral researcher and co-author of the study, said, “With fewer steps, we reduce the use of harmful chemicals. That’s safer for workers and better for the planet.”

The researchers demonstrated their method on molybdenum disulfide (MoS₂), a material that could play a role in developing future generations of computer chips.

The study was published in Chemistry of Materials and included contributions from Azeez Musa, Gordon Koerner, Nikhila Paranamana, and Matt Maschmann at Mizzou. The work was conducted at the MU Materials Science and Engineering Institute (MUMSEI), which is a collaboration between Mizzou’s College of Engineering and College of Arts and Science.